» GILDING

• Galvanic gilding of details
• Chemical gilding of details
• Gilding of small parts in the mortar
• Galvanic gilding of edges of printed circuits
• Galvanic gilding of surfaces of printed circuits
• Chemical gilding of printed circuits

» SILVER PLATING

» NICKEL-PLATING

» TINNING

» ANODIZING OF ALUMINUM

» OTHER

	Maximum dimensions: The maximum dimension of the circuit for chemical gilding is 40x35 cm.
	The parameters of the coat: Thickness of the coat - 0,05-0,1 µm, on the chemical nickel subcoat (pure gold without additions).

Requirements:
The circuits to be gilded cannot be covered by tin-lead coat. Not every anti-soldering layer stands the process of chemical gilding.