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  CHEMICAL GILDING OF PRINTED CIRCUITS
   
Maximum dimensions:
The maximum dimension of the circuit for chemical gilding is 40x35 cm.
The parameters of the coat:
Thickness of the coat - 0,05-0,1 µm, on the chemical nickel subcoat (pure gold without additions).

Requirements:
The circuits to be gilded cannot be covered by tin-lead coat. Not every anti-soldering layer stands the process of chemical gilding.